BGA Inspection for Bridges
- (X-Ray)
BGA Inspection is an excellent method for
identifying bridges between solder balls. |
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BGA Inspection for Poor
Wetting / Insufficient – (X-Ray)
eTech's
BGA Inspection procedures can identify poor
wetting and
insufficient reflow of a reworked BGA component. |
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BGA Inspection for Diameter,
area and Joint Density -
(X-Ray)
Calculation of Various measurements such as
diameter, area, and joint density of solder
balls on a BGA placement can be analyzed at eTech |
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BGA Inspection and Analysis
tool – (X-Ray)
Areas of interest can be analyzed within the
BGA and balls above or below a specified size
can be highlighted |
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BGA Inspection using 3D
Rendering - (X-Ray)
This is an example of 3D rendering. In this
example, voids are pronounced and easily detectible |
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BGA Inspection using Pseudo
Color Filter Analysis - (X-Ray)
Our Pseudo Color filter tool enhances the
analysis of voiding. A percent analysis can
be performed on any area of interest |
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Gull Wing Alignment - (X-Ray)
This example shows and example of an axis
view of a .5mm gull wing lead |
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Wirebond Analysis - (X-Ray)
This example is a view of wirebonds at high
magnification |
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BGA Inspection using Contour
Relief Filter - (X-Ray)
Contour filter highlights any voiding within
each solder ball. |
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