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Lead Free and Eutectic
   
 
An international customer whose core business is to provide ICs to a specific market has a need to provide BGA reballing for end user customers from around the world. These BGAs have been placed on circuit boards but are removed for various reasons and returned.
 
Solution:
The global customer call eTech about an initial first article run of Reballing BGAs that have been placed before. The batch was small (~20 BGAs) but we were happy to provide the service. eTech provided the BGA reballing service in a couple of days, vacuum packed them and shipped them internationally back to the customer where they were then used in their new application (BGA rework or BGA placement on new boards) with no quality issues. eTech provides a Certificate of Compliance with each shipment so the customer knows the process adheres to IPC and ESD standards. Each BGA is marked with a red dot (or other marking requested by the customer) so it is obvious that the BGA reballing has taken place on the chip. eTech offer baking of the parts either before or after the process as outlined in the JDEC standard.
 
Ultimately, the customer set up an RMA system and BGAs are sent directly to eTech from the end user. BGA reballing is performed and the chips are returned to the Global distributor. Some batches of BGA ICs have 1 or 2 two chips, while others have 50. There are times when BGA reballing is required on multiple different part numbers in once batch. For this customer, both Pb Free BGA and Pb based BGA reballing is required. eTech has been able to take care of the need and provide value to both the distributor as well as end user customer.