Problem:
A Customer who is to provide Clinical electronic Charts for Hospitals was in need of BGA rework for the PCBs. During the process of assembling their boards and final testing, the customer realized that the chips on the boards were failing - either due to bad chips or manufacturing issues. The manufacturing engineers turned to eTech for a solution.

Solution:
The plan put forth was to take 6 first article bards and rework 3 of them with new chips from a different lot. In addition, the other 3 boards were baked for 24 hours and the BGA was removed. A BGA reball process was used on the old chips and they were placed using the same rework process as was used on the new BGAs. Results of the testing proved that the 3 new BGAs worked fine while the reballed BGAs failed. The customer was then able to work with their chip supplier on a possible bad of BGAs.

In the meantime the total quantity of boards was reworked with new BGAs and the boards were successfully rolled out to their customer.