Unprepared Ceramic
Column Grid Array Site
After normal removal of a CCGA (Ceramic Column
Grid Array) component, excess solder remains
on the pads. This solder must be removed prior
to placement of a new CCGA component. The
solder left behind after the removal of a
component can also give us clues as to possible
failures of the initial attachment of a CCGA
or BGA. Oxidation is a common problem of failure
as well as imperfections in the printed circuit
board manufacturing process. With these instances
of contamination, solder will not make contact
with a pad and/or no solder will be left on
a particular pad site. eTech’s
BGA operators closely inspect each pad site
under a microscope after the removal of a
CCGA or BGA component.
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Site Dressed
Ceramic Column Grid Array Site
Solder is removed from CCGA (Ceramic Column
Grid Array) and BGA (Ball Grid Array) pad
sites using a Edsyn hot air solder vacuum
system. This ensures that our process is less
likely to cause damage to the site while removing
excess solder. eTech
uses solder wick only when absolutely necessary.
We have found that solder wick increased the
likelihood of solder mask damage on CCGA as
well as BGA components. |
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“Pasted”
Ceramic Column Grid Array Site
eTech
operators receive extensive training on proper
paste application. Paste application process
is critical in every placement, but becomes
more so with smaller pitch sizes in today’s
CCGA (Ceramic Column Grid Array) components.
The “dollops” of paste left behind
when a mini stencil is removed from the site,
must be uniform and look like tiny columns.
Our operators do a 100% inspection under a
microscope of all pasted sites before placement
of CCGA’s (Ceramic Column Grid Array).
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Component Alignment
of Ceramic Column Grid Array on Summit 1100
HR
Ceramic Column Grid Array Chip and PCB Pad
alignment are paramount. Improper alignment
of the CCGA component prior to placement can
result in bridges or improper electrical connections.
Our rework machines are equipped with Micrometer
adjustments to facilitate perfect CCGA alignments
with each placement. eTech
operators are trained to treat every CCGA
and BGA as one that needs to be perfectly
aligned to ensure success.
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Thermal Profiling
of Ceramic Column Grid Array on Summit 1100
HR
Our Technicians have over 12 years combined
experience in thermal profiling and are proficient
in optimizing the Summit 1100 HR profiling
system. The machine, while easily operated,
takes a “special skill” in profiling. eTech’s
successful rework capability is directly related
to our proficiency with the thermal profile
procedure. Our technicians utilize two methods
of profiling. The first method is the non-destructive
method. It utilizes multiple thermocouples
placed directly underneath the component to
be removed. The second method is the destructive
method, whereas the technician drills holes
through the board and into the solder joint
under the BGA or CCGA. This method yields
the most accurate temperature measurements;
however, destruction of the board and component
may not be an option for a particular application. |
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Component Reflow
of Ceramic Column Grid Array Component
Site preparation, component alignment and
Thermal profiles are the keys to successful
CCGA and BGA rework. This example shows a
reworked Ceramic Column Grid Array site after
reflow. The component is centered on the pad
and the filet is uniform and shiny. eTech’s
operators take pride with their ability to
consistently produce results as the one shown
here.
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X-ray and Quality Control
of Ceramic Column Grid Array Component
The final step in eTech’s
rework process are our X-Ray and Quality Control
procedures. Each CCGA and BGA placements are
individually x-rayed as well as given a four-point
visual inspection under a microscope. Operators
inspect for any imperfection with the component
placement as well as any collateral damage
to the reworked component. eTech
also offers this X-ray and Quality Control
Service to customers whereas production work
of the assemblies has been performed in other
facilities. |
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