ETech can assist with engineering changes and modifications in circuit paths on printed circuit boards at BGA sites as well as other locations. We often save our customers the costs associated with re-spinning and re-building printed circuit boards with our Engineering Change Order Service (ECO), saving both time and money in the prototype proof of concept cycle. ETech can also repair BGA pad damage and contamination caused by operator error and improper board manufacture. Contact us today with your project and we will show how we can be of assistance.

Multiple Engineering Changes can be accomplished without the need to re-spin a particular board. In this example, four unique Engineering Changes are visible on the pad sites of a 1-millimeter pitch BGA site.

eTech can assist you with Engineering changes that require wire jumpers under fine pitch BGA’s. The photo shows a wire jumper added to electrically connect two BGA pad sites together. The BGA is then re-installed and the wire addition becomes effective.

Oxidation and contamination can cause Ball Grid Arrays to not function or be intermittent. ETech can remove the BGA from the effected site, clean the contamination and re-tin the necessary pad sites, which previously adversely affected the chip’s function. We then can reball the BGA and re-install the component.

Wire additions (Engineering Changes) can be brought out from underneath BGA’s and then used to add additional parts to a circuit. In this example, a crystal has been added to the circuitry of a Ball Grid Array

eTech’s Level III technicians are able to replace and repair pulled BGA pad sites to fully functional status.

Wire additions (Engineering Changes) can be brought out from beneath BGA’s and then used to add to a circuit. In this example, two separate wire leads have been added. The leads have been connected to circuitry external to the 1-millimeter pitch BGA (BGA uninstalled).