ECN
• Re-Balling
• Lead free and Eutectic
• QuicK Turn
• uBGA, PBGA, TBGA
• Post production validation
• Fault detection
   and Evaluation
• Prototype Board Builds
• Machine and Hand Build
• Fine Pitch
• Kit or Turnkey
• Tool and Die
• Prototyping
• CAD Concept and Design
• Assembly Aids
 
 

Printed Circuit Board(PCB) Assembly Services

   
 
PCB Assembly  
   
Prototype Board Builds
Small Production Runs
.Machine and Hand Build
BGA, QFP, Fine Pitch
X-Ray Inspection
Kit or Turnkey
 
Equipment List
 
Zevatech Laser Alignment Pick And Place Machine
Heller 1088 Reflow Oven
MPM Screen Printer
SRT 1100 BGA Machine
X15LP Real Time X-Ray

PCB Capabilities

X-max 406mm (15.98 in)
Y-max 330mm (12.99 in)
Max Thickness – 2.5 mm (0.10 In)

PCB Assembly / PCB Prototype / Prototype Board
Zevatech Pick And Place Machine

 

eTech Utilizes a Zevatech PM570L pick and place machine which incorporates a laser alignment sensor for recognition and high accuracy placement of components from 0402’s to 33.5mm (1.32 inches) square including:

  • Square Chip
  • Electrolytic Capacitors
  • MELF
  • SOT
  • SOP
  • SOIC
  • PLCC
  • QFP
  • BGA

eTech is committed to providing quality prototypes with the quickest lead times. We can assist in component procurement or build from customer-supplied kits. eTech was founded on the basis of Quality, Service and Value and we use those guiding principals in all of our projects

   

Quality

eTech’s quality ensure the most reliable finished product on each project. We have over 15 years of experience in SMT manufacturing. We use the IPC standard a guideline for all manufacturing processes. Our on-site IPC certified trainer ensures all employees and processes follow these principals. The end result is quality you can rely on .

   

Service

Understanding the customer’s requirements are essential in the success of any project. Quick turn and cost efficiency are the benchmarks at eTech. We strive to provide the quickest turn around while being as cost effective as possible.

 

Value

Anything can be done – with enough time and money. No one has unlimited time and money. At eTech we try to offer as much value as possible in all of our processes. Whether it is how to place a BGA, IPC level III solder repair or building a prototype printed circuit board, eTech can assist in solving the most difficult issues.

Without doubt the most problematic issue with building prototypes and short run production is placing BGAs and CCGA correctly. At eTech, this is our core competency and something we do very well.